| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum chuck capable of correcting warpage of a thin plate object such as a wafer and reducing time required for sucking and holding the object, while suppressing generation of particles and such.SOLUTION: A vacuum chuck 1 includes an annular wall member 2 in contact with an outer peripheral surface of the vacuum chuck 1 all over the circumference. The annular wall member 2 is annually and evenly extended beyond a reference surface in a direction opposite to an action direction of a vacuum suction force with respect to an object W. Thus, a tip of the annular wall member 2 is in contact with an outer area annually surrounding an inner area of the object W all over or almost all over the circumference.SELECTED DRAWING: Figure 1 |
