SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To reduce the thickness and the thermal resistance of a semiconductor device.SOLUTION: A semiconductor device comprises: a substrate; a semiconductor element provided on the substrate; an encapsulation resin that covers the semiconductor element; and a heat radiation plate provided in the encapsulation resin, and that has first and second heat radiation parts arranged on the semiconductor element. At least a part of the second heat radiation part is exposed from a lateral face of the encapsulation resin. The second heat radiation part is thicker than the first heat radiation part.SELECTED DRAWING: Figure 5