| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which cracks is unlikely to occur in an insulating material adjacent to a surface pad even when a light emitting element and the like which has hit heat generation amount on a surface pad formed on a surface of a board body composed of an insulating material, and a radiation direction of heat is not likely to deviate and capacitance of the board body can be kept uniform even when the light emitting element and the like is mounted on a surface of a mother board in an inclined manner.SOLUTION: A wiring board 1a comprises: a board body 2 which is composed of ceramic (insulating material) and has a surface 3 and a rear face 4 which are parallel with each other and a lateral face 5 located between the surface 3 and the rear face 4; a surface pad 6 formed on the surface 3 of the board body 2; a heat radiation part 8a embedded inside the board body 2; and a first connection part for connecting the surface pad 6 and the heat radiation part 8a. the heat radiation part 8a is a sphere 9, and in plan view, an area of the first connection part 11 exposed on the surface 3 of the board body is smaller than an area of the surface pad 6.SELECTED DRAWING: Figure 1 |
