| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate and a manufacturing method of the same.SOLUTION: In a manufacturing method of a substrate with a bump, by controlling a thickness of a nickel layer 150 on a copper layer 140 after at least one copper layer 140 is formed on a semiconductor substrate 110, hardness of the bump composed of the copper layer 140 and the nickel layer 150 meets a required standard after an anneal process thereby to prevent burst of a glass substrate 200 when the substrate having the bump is associated with the glass substrate 200 by flip chip.SELECTED DRAWING: Figure 2 |
