| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, and a semiconductor device, capable of preventing peel-off of an insulation part formed on a lateral face of a semiconductor substrate, and generation of air bubbles in the insulation part.SOLUTION: A method of manufacturing a semiconductor device includes: a step of putting in a first molding mold a semiconductor substrate on whose first principal surface a first electrode is formed, on whose second principal surface at an opposite side to the first principal surface a second electrode is formed, and whose lateral face is coated by resin, to form a first insulation part contacted with the resin coating; and a step of putting in a second molding mold the semiconductor substrate on which the first insulation part is formed to form a second insulation part that covers the first insulation part.SELECTED DRAWING: Figure 1 |
