| 摘要 |
The present invention relates to a plating apparatus which blocks a flow of surplus current to make a thickness of a plating film uniform. According to the present invention, the plating apparatus comprises: an electric shielding device including a perforated plate and a shielding plate which adaptively and variably adjusts a shielding area of the perforated plate in accordance with a panel size. The perforated plate in accordance with the present invention comprises: a perforated net wherein a circular perforation arrangement having a predetermined diameter is configured longitudinally and transversely; the shielding plate is able to be moved up and down along a guide rail by a motor drive; and an effective pass area of an electric line of force from an anode to a cathode is controlled by varying an area of blocking and shielding the perforation arrangement of the perforated plate while moving up and down. |
