METHOD FOR MANUFACTURING WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of achieving a package with excellent durability in a high yield.SOLUTION: An opening 28 forming step forms an opening 28 through which a part of a conductor pattern 24 is exposed to a prescribed region of an insulating resin film 10. A desmear treatment step subjects a surface of an insulating resin film 10 and the opening 28 to desmear treatment. A plating film 246 forming step forms a plating film 246 in the opening 28. A plasma treatment step subjects the insulating resin film 10 and a surface of the plating film 246 to plasma treatment. The opening 28 forming step also includes a step of irradiating a region serving as the opening 28 with a laser beam in the insulating resin film 10. The plasma treatment step performs plasma treatment without etching the insulating resin film 10.SELECTED DRAWING: Figure 2