发明名称 ADDITION-CURABLE SILICONE RESIN COMPOSITION, ADDITION-CURABLE SILICONE RESIN CURED PRODUCT, AND OPTICAL SEMICONDUCTOR ELEMENT SEALING BODY
摘要 PROBLEM TO BE SOLVED: To provide an addition-curable silicone resin composition that is excellent in low gas permeability, interface adhesiveness, and moist heat resistance, and an optical semiconductor element sealing body.SOLUTION: An addition-curable silicone resin mixture comprises a silicone resin represented by the formula (1-1) and/or a silicone resin represented by the formula (1-2).SELECTED DRAWING: None
申请公布号 JP2016030827(A) 申请公布日期 2016.03.07
申请号 JP20140155431 申请日期 2014.07.30
申请人 SUMITOMO SEIKA CHEM CO LTD 发明人 YAMAMOTO KATSUMASA;FUKUDA NORIAKI;SANADA SHOHEI
分类号 C08L83/07;C08L83/05;C08L83/08;H01L33/56 主分类号 C08L83/07
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