| 摘要 |
The present invention provides a circuit board structure which comprises: a circuit pattern formed on a surface of a substrate; a land formed in the end of the circuit pattern, and having a solder coated by a soldering process; and a solder resist coated on the surface of the substrate, and insulating not to coat the solder by the soldering process in the circuit pattern. A connection pattern positioned on a border between the circuit pattern and the land, and connecting the circuit pattern and the land is formed to be getting smaller from a diameter of a land being at right angle with the circuit pattern to the terminal of the circuit pattern, and provides a circuit board structure for preventing a crack of the connection pattern. |
