| 摘要 |
The present invention aims to achieve compactness of a semiconductor device. A method for manufacturing the semiconductor device according to the present invention fixes a chip mounting part (TAB1), by pressurizing a convex part (CVX1) to a side (SSF5) and a side (SSF6) except a side (SSF2) of the chip mounting part (TAB1), and on the other hand, does not form the convex part (CVX1) corresponding to the side (SSF2) of the chip mounting part (TAB1). Similarly, the method fixes a chip mounting part (TAB2), by pressurizing a convex part (CVX2) to a side (SSF7) and a side (SSF8) except a side (SSF3) of the chip mounting part (TAB2), and on the other hand, does not form the convex part (CVX2) corresponding to the side (SSF3) of the chip mounting part (TAB2). |
