| 摘要 |
The present invention relates to a device for treating a large area substrate. More specifically, the purpose of the present invention is to provide a device for treating a large area substrate wherein injection plate holes formed in an injection plate, which is arranged on the top of a showerhead, are differently arranged per a section of the injection plate. To achieve the same, the device for treating the large area substrate according to the present invention includes: a chamber with a reaction space; a substrate supporting unit supporting the large area substrate; a diffuser cover mounted on the top of the substrate supporting unit inside the chamber and supplying a gas to be vacuum-evaporated to the large area substrate; the showerhead with multiple shower holes, mounted on the underside of the diffuser cover, and injecting the gas to the substrate supporting unit through the shower holes; and the injection plate including the multiple injection plate holes, arranged between the showerhead and the diffuser cover, and injecting the gas injected from the diffuser cover to the showerhead through the injection plate holes. The injection plate holes are arranged differently per the section of the injection plate. |
