| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing an optical device wafer that can grind the back surface of an optical device wafer to thin the optical device wafer without performing attachment/detachment of adhesive tape and then form DBR film on the back surface of the optical device wafer.SOLUTION: A method of processing an optical device wafer having an optical device layer formed on the surface thereof comprises a step of forming DBR film on one surface of a sheet-like member having resistance to heat, a joint step of making the DBR film confront the back surface of the optical device wafer and mounting the sheet-like member on the back surface of the optical device wafer to join the DBR film to the back surface of the optical device wafer under a vacuum environment after the film forming step is executed, and then taking out the optical device wafer and the sheet-like member to the air atmosphere, and a peeling step of peeling the sheet-like member from the DBR film joined to the back surface of the optical device wafer after the joint step is executed.SELECTED DRAWING: Figure 5 |
