发明名称 LIGHT/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a light/moisture-curable resin composition having excellent shape retention properties, adhesive properties, rapid curing properties and coating properties, and provide an adhesive for electronic components and an adhesive for display devices prepared with the light/moisture-curable resin composition.SOLUTION: The present invention is a light/moisture-curable resin composition containing a radically polymerizable compound, a moisture-curable urethane resin, a photo-radical polymerization initiator and a filler.SELECTED DRAWING: None
申请公布号 JP2016029186(A) 申请公布日期 2016.03.03
申请号 JP20150224959 申请日期 2015.11.17
申请人 SEKISUI CHEM CO LTD 发明人 TAKAHASHI TORU;YUKI AKIRA;KUNIHIRO YOSHITAKA;KIDA TAKUMI
分类号 C08F2/48;C08F2/44;C09J4/00;C09J11/04;C09J11/06;C09J175/04 主分类号 C08F2/48
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