发明名称 |
LIGHT/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a light/moisture-curable resin composition having excellent shape retention properties, adhesive properties, rapid curing properties and coating properties, and provide an adhesive for electronic components and an adhesive for display devices prepared with the light/moisture-curable resin composition.SOLUTION: The present invention is a light/moisture-curable resin composition containing a radically polymerizable compound, a moisture-curable urethane resin, a photo-radical polymerization initiator and a filler.SELECTED DRAWING: None |
申请公布号 |
JP2016029186(A) |
申请公布日期 |
2016.03.03 |
申请号 |
JP20150224959 |
申请日期 |
2015.11.17 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
TAKAHASHI TORU;YUKI AKIRA;KUNIHIRO YOSHITAKA;KIDA TAKUMI |
分类号 |
C08F2/48;C08F2/44;C09J4/00;C09J11/04;C09J11/06;C09J175/04 |
主分类号 |
C08F2/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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