| 发明名称 |
METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE |
| 摘要 |
A method for fabricating a circuit board structure is provided. The method includes providing a first circuit board and a second circuit board, wherein the area of the second circuit board is less than the area of the first circuit board. The first circuit board and the second circuit board are combined by a surface mount technology to form the circuit board structure having a portion with a different number of layers. |
| 申请公布号 |
US2016066436(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201414565738 |
申请日期 |
2014.12.10 |
| 申请人 |
Quanta Computer Inc. |
发明人 |
Chuang Tung-Lin;Yen Chi-Yi |
| 分类号 |
H05K3/36;B23K1/00;H05K3/30 |
主分类号 |
H05K3/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating a circuit board structure, comprising:
providing a first circuit board; providing a second circuit board, wherein an area of the second circuit board is less than an area of the first circuit board; and combining the first circuit board with the second circuit board by a surface mount technology to form the circuit board structure having a portion with a different number of layers. |
| 地址 |
Kuei Shan Hsiang TW |
