发明名称 Cell Layout and Structure
摘要 A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.
申请公布号 US2016063166(A1) 申请公布日期 2016.03.03
申请号 US201414473614 申请日期 2014.08.29
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Hsieh Tung-Heng;Wang Sheng-Hsiung;Zhuang Hui-Zhong;Yeh Yu-Cheng;Tsai Tsung-Chieh;Wu Juing-Yi;Lee Liang-Yao;Ting Jyh-Kang
分类号 G06F17/50;H01L27/02 主分类号 G06F17/50
代理机构 代理人
主权项 1. A method of designing a semiconductor device, the method comprising: placing a first cell and a second cell into a first cell row; placing a third cell and a fourth cell into a second cell row adjacent to the first cell row; performing, using a microprocessor, a post placement treatment after the placing the first cell and the second cell and after the placing the third cell and the fourth cell, wherein the performing the post placement treatment further comprises: combining a first via in the first cell and a second via in the third cell into a third via; andremoving a fourth via from the first cell without severing an electrical connection.
地址 Hsin-Chu TW