ELECTRICAL-DEVICE PACKAGE

摘要

The purposes of the present invention are to reduce the overall thickness, to reduce the power consumption of a heater for temperature adjustment, and to suppress positional deviation of an optical axis due to heat in a package (100) in which an electrical device (103) such as a laser diode, a MEMS sensor device, or a liquid crystal device is hermetically sealed. In the package (100) according to the present invention, a chip carrier (107) includes a temperature adjusting device, such as a heater (109), and the chip carrier (107) is fixed and held integrally with the electrical device (103). Of the electrical device (103) and the chip carrier (107), only the electrical device (103) is fixed to the inner surface of the casing of the package via a fixing part (120). With this configuration, most of the heat generated from the heater (109) is supplied efficiently for temperature adjustment of the electrical device (103), and it is possible to considerably suppress transfer of heat to the casing of the package or leakage of heat to the outside of the casing.