DEVICE AND METHOD FOR PREHEATING WAFER VIA VACUUM LOADING CHAMBER

摘要

A device and method for preheating a wafer via a vacuum loading chamber. Via the addition of a heatable vacuum loading chamber, a wafer is pre-heated before a deposition reaction, and when the temperature of the wafer meets requirements, the wafer is fed into a reaction chamber for the deposition reaction, so as to increase efficiency and improve production capacity. Pre-heating chambers having different structures are mounted at different positions according to different process flows, so as to implement functions such as pre-heating, heating or insulating on the wafer. The device and method are applied to the technical field of semiconductor thin film deposition application and manufacturing.