| 摘要 |
In a method to form a protective film on the surface of a wafer by using spin coating, a protective film coating method and a protective film coating device capable of forming a uniform protective film on the surface of a wafer even if a liquid-phase resin forming the protective film is insufficiently supplied. A protective film coating method to form a protective film by coating a liquid-phase resin on the surface of a wafer to be laser-assisted fabricated comprises: a wafer keeping process of orientating and keeping the surface of a wafer upward on a spinner table; a liquid-phase resin dropping process of dropping liquid-phase resin on the center of the surface of a wafer kept on the spinner table; a water layer forming process of forming a water layer on the entire surface of the water by supplying water on the resin-supplied water; a liquid-phase resin spreading process of forming a thin protective film layer on the entire surface of the wafer by rotating the spinner table and spreading the liquid-phase resin using a centrifugal force; a liquid-phase resin supply process of supplying liquid-phase resin larger than that in the liquid-phase resin dropping process on the entire surface of the wafer while rotating the spinner table slower than that in the liquid-phase resin spreading process; and a protective film forming process of forming a protective film on the entire surface of the wafer by rotating the spinner table faster than that in the liquid-phase resin supply process and extending the liquid-phase resin using the centrifugal force applied to the liquid-phase resin. |
