| 摘要 |
PROBLEM TO BE SOLVED: To provide an abrasive pad for detecting an eddy current endpoint.SOLUTION: An abrasive pad for polishing a semiconductor substrate by using eddy current endpoint detection is described. A method of manufacturing an abrasive pad for polishing a semiconductor substrate by using eddy current endpoint detection is also described. The abrasive pad is an abrasive pad for polishing the semiconductor substrate, and has a casted uniform polishing body having a polishing surface and a back surface, and an endpoint detection area which is disposed in the casted uniform polishing body and covalently bonded to the casted uniform polishing body. The endpoint detection area has a material different from the casted uniform polishing body, and at least a part of the endpoint detection area is retracted from the back surface of the casted uniform polishing body.SELECTED DRAWING: Figure 1A |
