| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for power that can enhance the lifetime of a joint portion under a wire terminal and has high reliability.SOLUTION: A semiconductor device 100 for power comprises a resin housing, a first board which is mounted in the resin housing and has a circuit pattern 13 formed on a metal plate 11 through an insulation layer 12, semiconductor elements 8 and 9 which are mounted in the resin housing and disposed on the circuit pattern 13, a wire terminal 4 connected to the semiconductor elements 8 and 9, and an insulation sealing material 7 filled in the resin housing. The wire terminal 4 has a folding structure, the outer surface of the folding structure which is in contact with the semiconductor elements 8 and 9 is fixed to the semiconductor elements 8 and 9, and two inner surfaces which are contained in the folding structure and folded back to face each other can be separated from each other.SELECTED DRAWING: Figure 2 |
