Method for Producing Window Elements that Can Be Soldered into a Housing in a Hermetically Sealed Manner and Free-Form Window Elements Produced in Accordance with Said Method

摘要

A method for production of window elements which can be soldered into a housing in a hermetically tight manner with optical coating and free-form window elements are disclosed. After application of optical coatings, a protective layer is applied to the optical coating, the two layer systems are selectively removed by means of a machining beam of high-energy radiation for the purpose of ablation of a desired optically active free-form surface for window elements with any geometric shape through a localized machining beam in edge regions of the optically active free-form surface such that the protective layer remains on the optical coating as lift-off mask which is lifted off after applying a metallization for a solder layer by an etching process that acts selectively only on the protective layer but not on the optical coating, and the metallization remains only on the peripheral edge regions circumscribing the free-form surfaces.

主权项

1. A method for production of window elements for soldering into a housing in a hermetically tight manner in which optically transparent, flat substrate material having dimensions sufficient for a plurality of window elements is machined consecutively according to the following steps:
a) applying at least one optical coating to at least one surface of the optically transparent, flat substrate material; b) coating the optical coating with a protective layer which is an etchable layer, meaning a sacrificial layer; c) selectively removing the protective layer and the optical coating from the substrate material for generating windows elements of any geometric shape by ablating edge regions of at least one, optically active free-form surface of the window elements by means of a directed machining beam of high-energy radiation and circumscribing periphery of the at least one optically active free-form surface such that the protective layer remains on the optical coating as a mask covering the at least one desired optically active free-form surface; d) ablating a portion of the substrate material along the peripheral edge regions by means of the directed machining beam of high-energy radiation and forming at least one lowered step having a defined roughness in the edge regions of the substrate material, wherein the at least one step lies below a height level of the substrate material at which the optical coating is disposed by more than a thickness of a single layer of the optical coating; e) coating a surface of the substrate material having the optical coating covered by the protective layer and having the peripheral edge regions of the at least one window element through overlaying metallization of the surface with a solder layer system; f) removing the metallization over the optical coating by selectively etching the protective layer but not the optical coating and only minimally on the solder layer system, and lifting off the metallization of the solder layer system adhering to the protective layer by undercutting so that the solder layer system remains only on the locally machined peripheral edge regions circumscribing the optically active free-form surfaces; and g) cutting out individual window elements from the substrate material along cutting lines by the directed machining beam either after the metallization is removed in step f) or already after the ablation of the edge regions of the window elements in step d).