| 摘要 |
Disclosed are a packaging system of an electronic device and a packaging method of the electronic device. The disclosed packaging system of the electronic device includes: a first jig which has a groove formed to accommodate the electronic device, and has a plurality of aligning posts prepared on one plane; a circuit board support part which supports a circuit board by being connected to the circuit board, and has a plurality of first guide holes into which the aligning posts are inserted; and a second jig which is prepared to apply pressure to the circuit board, and has a plurality of second guide holes into which the aligning posts are inserted. According to the present invention, the electronic device can be accurately aligned without causing any damage thereto to be mounted on and bonded to the circuit board. |
