| 摘要 |
A subject of the present invention is to provide a method for polishing a peripheral part of a wafer having a hard film formed thereon by a polishing tape while preventing damage to the polishing tape. According to the present invention, the polishing method uses: a base film made of polyamide; a binder made of polyamide; and the polishing tape (180) having grains held and supported by a binder. The polishing method rotates a silicon substrate (W) having a silicon carbide film formed on a surface thereof and presses the polishing tape (180) to the silicon carbide film on a peripheral part of the silicon substrate (W) by low power to eliminate the silicon carbide film from the peripheral part of the silicon substrate (W). |
