| 摘要 |
PROBLEM TO BE SOLVED: To provide a material of a high carbon content which is useful as an underlayer in a semiconductor manufacturing process, has high thermal stability, a high carbon content, a low H content, high elasticity and high film density, and has adequate etching selectivity and etching resistance against Oand CFplasma.SOLUTION: A polymerization reaction product contains a unit in which a unit of a specific tetraarylmethane monomer having an active group is polymerized represented by Formula (1). In the formula (1), Ag is an active group such as OH; Ar1 to Ar4 are each independently an aryl part; R1 to R4 are each independently alkyl, alkenyl, aralkyl or aryl; any two combinations of Ar1 to Ar4 may form a 5- or 6-membered condensed alicyclic ring together with carbon to which they are bonded; a is an integer of 0 to 4; and b, c and d are each independently an integer of 0 to 5.SELECTED DRAWING: None |
