发明名称 |
METHOD FOR MANUFACTURING SHIELD PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a shield printed wiring board capable of reducing a cost; a shield film; and a shield printed wiring board.SOLUTION: A method for manufacturing a shield printed wiring board 10 includes the steps of: forming a shield film 1 having an insulating layer 7 which is a resin that has been polymerized until the degree of cure of a resin is equal to or larger than 90%, a metal layer 8a stacked on the insulating layer 7, and an adhesive layer 8b stacked on the metal layer 8a; mounting the shield film 1 on a printed circuit board 5; and heating and pressing the shield film 1 and the printed circuit board 5.SELECTED DRAWING: Figure 6 |
申请公布号 |
JP2016029748(A) |
申请公布日期 |
2016.03.03 |
申请号 |
JP20150235803 |
申请日期 |
2015.12.02 |
申请人 |
TATSUTA ELECTRIC WIRE & CABLE CO LTD |
发明人 |
TAJIMA HIROSHI;IWASAKI MASAYOSHI;UENO KENJI;HARUNA YUSUKE |
分类号 |
H05K3/28;H05K1/02;H05K9/00 |
主分类号 |
H05K3/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|