发明名称 METHOD FOR MANUFACTURING SHIELD PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a shield printed wiring board capable of reducing a cost; a shield film; and a shield printed wiring board.SOLUTION: A method for manufacturing a shield printed wiring board 10 includes the steps of: forming a shield film 1 having an insulating layer 7 which is a resin that has been polymerized until the degree of cure of a resin is equal to or larger than 90%, a metal layer 8a stacked on the insulating layer 7, and an adhesive layer 8b stacked on the metal layer 8a; mounting the shield film 1 on a printed circuit board 5; and heating and pressing the shield film 1 and the printed circuit board 5.SELECTED DRAWING: Figure 6
申请公布号 JP2016029748(A) 申请公布日期 2016.03.03
申请号 JP20150235803 申请日期 2015.12.02
申请人 TATSUTA ELECTRIC WIRE & CABLE CO LTD 发明人 TAJIMA HIROSHI;IWASAKI MASAYOSHI;UENO KENJI;HARUNA YUSUKE
分类号 H05K3/28;H05K1/02;H05K9/00 主分类号 H05K3/28
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