| 发明名称 |
SOLID IMAGING DEVICE |
| 摘要 |
A solid imaging device to an embodiment includes a semiconductor substrate and a conductive film. The semiconductor substrate has a plurality of photoelectric conversion elements constituting a plurality of pixels formed therein, the semiconductor substrate having a first surface and a second surface opposite to the first surface and being equipped with a wire layer on a first surface side of the semiconductor substrate. The conductive film is patterned and arranged above a border between pixels of the plurality of pixels on a second surface side of the semiconductor substrate. The conductive film is substantially transparent to visible light. |
| 申请公布号 |
US2016064441(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514610692 |
申请日期 |
2015.01.30 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SASAKI Hiroki;KOKUBUN Koichi |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solid imaging device comprising:
a semiconductor substrate having a plurality of photoelectric conversion elements constituting a plurality of pixels formed therein, the semiconductor substrate having a first surface and a second surface opposite to the first surface and being equipped with a wire layer on a first surface side of the semiconductor substrate; and a conductive film patterned and arranged above a border between pixels of the plurality of pixels on a second surface side of the semiconductor substrate, the conductive film being substantially transparent to visible light. |
| 地址 |
Tokyo JP |
