Semiconductor Device Package and Methods of Packaging Thereof

摘要

An embodiment of the present invention describes a method for forming a doped region at a first major surface of a semiconductor substrate where the first doped region being part of a first semiconductor device. The method includes forming an opening from the first major surface into the semiconductor substrate and attaching a semiconductor die to the semiconductor substrate at the opening. The semiconductor die includes a second semiconductor device, which is a different type of semiconductor device than the first semiconductor device. The method further includes forming a chip isolation region on sidewalls of the opening and surrounding the second semiconductor device, and singulating the semiconductor substrate.

主权项

1. A method of forming a semiconductor device, the method comprising:
forming a first doped region at a first major surface of a semiconductor substrate, the first doped region being part of a first semiconductor device; forming an opening from the first major surface into the semiconductor substrate; attaching a semiconductor die to the semiconductor substrate at the opening, the semiconductor die comprising a second semiconductor device, wherein the second semiconductor device is a different type of semiconductor device than the first semiconductor device, wherein the attaching comprises heating the semiconductor substrate to form a conductive bond between the semiconductor die and the semiconductor substrate; forming a chip isolation region on sidewalls of the opening and surrounding the second semiconductor device; and singulating the semiconductor substrate.