Bump on Pad (BOP) Bonding Structure

摘要

The embodiments described above provide enlarged overlapping surface areas of bonding structures between a package and a bonding substrate. By using elongated bonding structures on either the package and/or the bonding substrate and by orienting such bonding structures, the bonding structures are designed to withstand bonding stress caused by thermal cycling to reduce cold joints.

主权项

1. A method of forming a semiconductor device, the method comprising:
receiving a die package having a conductive post, wherein an outermost surface of the conductive post has a first surface area; receiving a substrate having a metal pad and an overlying solder resist layer, the solder resist layer having an opening exposing the metal pad, the substrate further comprising a solder layer filling the opening, wherein the opening has a second surface area, wherein the metal pad has a third surface area, wherein the conductive post, the opening, or the metal pad has a racetrack shape, wherein the third surface area is greater than the second surface area; and bonding the die package to the substrate.