INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.

主权项

1. An interposer substrate, comprising:
a first insulating layer having a first surface and a second surface opposing the first surface; a first wiring layer formed on the first surface of the first insulating layer; a plurality of conductive pillars formed in the first insulating layer and on the first wiring layer, and connected to the second surface of the first insulating layer; a second wiring layer formed on the second surface of the first insulating layer and electrically connected with the conductive pillars; and a second insulating layer formed on the second surface of the first insulating layer and the second wiring layer, wherein a portion of a surface of the second wiring layer is exposed from the second insulating layer.