| 发明名称 |
PROCESSING APPARATUS, PROCESSING METHOD, AND DEVICE MANUFACTURING METHOD |
| 摘要 |
A processing apparatus that performs processing to a wafer is provided, the processing apparatus comprising a wafer chuck disposed on a stage and that holds the wafer; three pins that attract the wafer and move the wafer from the wafer chuck; and a control unit that is configured to stop or decrease the attraction of the three pins based on information about a through hole of the wafer when the wafer is moved from the wafer chuck by the three pins. |
| 申请公布号 |
US2016064266(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514834742 |
申请日期 |
2015.08.25 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Hirano Shinichi |
| 分类号 |
H01L21/683;G03F7/32;G03F7/20 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A processing apparatus that performs processing to a substrate, the processing apparatus comprising:
a chuck disposed on a stage and that holds the substrate; an attracting unit that attracts the substrate and moves the substrate from the chuck; and a control unit configured to stop or decrease attraction of the attracting unit based on information about a through hole of the substrate in a case where the substrate is moved from the chuck by the attracting unit. |
| 地址 |
Tokyo JP |
