发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad. |
申请公布号 |
US2016059380(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201514832767 |
申请日期 |
2015.08.21 |
申请人 |
EBARA CORPORATION |
发明人 |
YAMAGUCHI Kuniaki;KOBATA Itsuki;MIZUNO Toshio;MIYAZAKI Mitsuru;TOYOMURA Naoki;INOUE Takuya |
分类号 |
B24B53/017;B08B3/12;B08B3/10;B08B3/02;H01L21/306;B08B1/00 |
主分类号 |
B24B53/017 |
代理机构 |
|
代理人 |
|
主权项 |
1. A buff process module, comprising:
a buff table on which a substrate is mounted; a buff head configured to hold a buff pad for applying a predetermined process to the substrate; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad. |
地址 |
Tokyo JP |