发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.
申请公布号 US2016059380(A1) 申请公布日期 2016.03.03
申请号 US201514832767 申请日期 2015.08.21
申请人 EBARA CORPORATION 发明人 YAMAGUCHI Kuniaki;KOBATA Itsuki;MIZUNO Toshio;MIYAZAKI Mitsuru;TOYOMURA Naoki;INOUE Takuya
分类号 B24B53/017;B08B3/12;B08B3/10;B08B3/02;H01L21/306;B08B1/00 主分类号 B24B53/017
代理机构 代理人
主权项 1. A buff process module, comprising: a buff table on which a substrate is mounted; a buff head configured to hold a buff pad for applying a predetermined process to the substrate; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.
地址 Tokyo JP