发明名称 CENTERLESS GRINDING APPARATUS
摘要 Some implementations of the described invention provide an improved centerless grinding apparatus in which grinding is efficiently operated by reducing the idle time of the grinding wheel. While the described apparatus can comprise any suitable feature, in some cases, it includes a first regulating wheel and a second regulating wheel are axially aligned side by side. In some cases, a first grinding area is provided between the first regulating wheel and a first blade. In some cases, a second grinding area is provided between the second regulating wheel and a second blade. Additionally, in some cases, a grinding wheel is mounted on a grinding wheel Z-slide to be moved reciprocatively between the first grinding area and the second grinding area. In this way, grinding is efficiently operated by reducing the idle time of the grinding wheel.
申请公布号 US2016059372(A1) 申请公布日期 2016.03.03
申请号 US201414473369 申请日期 2014.08.29
申请人 Micron Machinery Co., Ltd 发明人 Sagae Mohee;Takase Fumio;Hasumi Tomihiko;Saito Hidenori
分类号 B24B7/02 主分类号 B24B7/02
代理机构 代理人
主权项 1. A centerless grinding apparatus in which a grinding wheel grinds a work supported on a regulating wheel and a blade spaced apart from and facing to each other comprising: a regulating wheel having a first regulating wheel and a second regulating wheel which are axially aligned with respect to each other; a first blade disposed spaced apart from and facing to said first regulating wheel to form a first grinding area therebetween; a second blade disposed spaced apart from and facing to said second regulating wheel to form a second grinding area therebetween; a grinding wheel mounted on a grinding wheel slide which moves forward and backward to make the grinding wheel face said first grinding area and said second grinding area reciprocatively; wherein said grinding wheel performs oscillation grinding on a work supported on said first regulating wheel and said first blade when it is positioned in said first grinding area, and wherein said grinding wheel performs oscillation grinding on a work supported on said second regulating wheel and said second blade when it is positioned in said second grinding area.
地址 Yamagata JP