COMPONENT-EMBEDDED SUBSTRATE AND COMMUNICATION MODULE

摘要

A component-embedded substrate includes a first embedded component positioned in a layer close to a mounting electrode and a second embedded component positioned in a layer farther away from the mounting electrode than the first embedded component. The first and second embedded components include electrically connected terminals. Each resin film of the substrate is formed of thermoplastic resin. The first embedded component has more terminals than the second embedded component. Many of the internal wires from the first and second embedded component extend towards a mounting surface where the mounting electrode is provided. However, since in plan view the area of the first embedded component is smaller than the second embedded component, and the first embedded component is disposed closer to the mounting surface than the second embedded component, there is space for routing the internal wires at the side of the mounting surface of the substrate.

主权项

1. A component-embedded substrate in which a plurality of embedded components that are electrically connected to a conductor formed at the multilayer substrate are provided in a multilayer substrate including a plurality of resin films that are stacked upon each other, and in which a mounting electrode is formed at a principal surface, the component-embedded substrate comprising:
a first embedded component that is positioned in a layer that is close to the mounting electrode, the first embedded component including terminals that are electrically connected to a conductor formed at the multilayer substrate; and a second embedded component that is positioned in a layer that is farther away from the mounting electrode than the layer where the first embedded component is positioned, the second embedded component including terminals that are electrically connected to a conductor formed at the multilayer substrate, wherein each resin film is formed of thermoplastic resin, wherein the number of terminals of the first embedded component is larger than the number of terminals of the second embedded component, and wherein, in plan view, an area of the first embedded component is smaller than an area of the second embedded component.