| 发明名称 |
EPOXY RESIN COMPOSITIONS BASED ON BISPHENOL A TYPED EPOXY RESIN FOR HIGH PRESSURE RESIN TRANSFER MOLDING |
| 摘要 |
Provided is an epoxy resin composition for high pressure-resin transfer molding (HP-RTM) based on a bisphenol A-type epoxy resin comprising a bisphenol A-type epoxy resin; a reactive diluent; and a curing agent. The epoxy resin composition for HP-RTM has viscosity of 100-900 cps at 25°C, gel time of 10-180 seconds, and glass transition temperature of 60-180°C. |
| 申请公布号 |
KR101599304(B1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
KR20150121155 |
申请日期 |
2015.08.27 |
| 申请人 |
SHIN-A T&C |
发明人 |
CHOI, HO KYOUNG;CHOI, JONG HA;LIM, SUNG SIK;PARK, JUN SEONG;PARK, KYEONG JUNE |
| 分类号 |
C08L63/00;C08K5/00;C08K5/06;C08K5/17 |
主分类号 |
C08L63/00 |
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