发明名称 THERMALLY CONDUCTIVE POLYCARBONATE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive polycarbonate resin composition that has excellent thermal conductivity and a high level of heat resistance while showing particularly excellent impact resistance, and a molding thereof.SOLUTION: A thermally conductive polycarbonate resin composition comprises, based on 100 pts.mass of polycarbonate resin, 10-50 pts.mass of boron nitride, and 15-80 pts.mass of talc with an average particle diameter of 10 μm or more.SELECTED DRAWING: None
申请公布号 JP2016029142(A) 申请公布日期 2016.03.03
申请号 JP20150076808 申请日期 2015.04.03
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 TAJIMA HIROYUKI
分类号 C08L69/00;C08K3/32;C08K3/34;C08K3/38;C08L83/04 主分类号 C08L69/00
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