发明名称 FLEXIBLE PRINTED CIRCUIT (FPC) BOARD
摘要 A flexible printed circuit (FPC) board having reinforcing pattern against bending is disclosed. The FPC board provides an RF interconnection extending from an RF electrode. Two ground electrodes are formed in respective sides of the RF electrode. The ground electrodes extend respective extended portions along the RF interconnection to protect the RF interconnection from breakage due to bending of the FPC board. The extended portion provides an end portion bent toward the RF interconnection to compensate for impedance mismatching of the RF interconnection.
申请公布号 US2016066425(A1) 申请公布日期 2016.03.03
申请号 US201514839109 申请日期 2015.08.28
申请人 Sumitomo Electric Device Innovations, Inc. 发明人 IIZAKA Shinya
分类号 H05K1/14;H05K1/11;H05K3/36;H05K1/02 主分类号 H05K1/14
代理机构 代理人
主权项 1. A flexible printed circuit (FPC) board soldered to a rigid circuit board, comprising: a top electrode provided in a top surface of one end of the FPC board; and a back electrode provided in a back surface of the one end of the FPC board, the back electrode being connected to the top electrode through a via hole and soldered to a pad provided in the rigid circuit board, wherein at least one of the top electrode and the back electrode extends an interconnection and another of the top electrode and the back electrode extends an extended portion terminated in the one end of the FPC board.
地址 Yokohama-shi JP