发明名称 LED DIE AND METHOD OF MANUFACTURING THE SAME
摘要 An LED die includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, a transparent conductive layer, a first electrode and a second electrode. The first semiconductor layer, the active layer, the second semiconductor layer and the transparent conductive layer are successively formed on the substrate. The first electrode and the second electrode respectively is formed on the first semiconductor layer and the transparent conductive layer. A plurality of grooves defined on the first semiconductor layer, and a plurality of hole groups defined on the second semiconductor layer. The present disclosure also provides a method of manufacturing the LED die.
申请公布号 US2016064605(A1) 申请公布日期 2016.03.03
申请号 US201514820268 申请日期 2015.08.06
申请人 ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 HUANG CHIA-HUNG;CHIU CHING-HSUEH;YANG SHUN-KUEI;TU PO-MIN;HUANG SHIH-CHENG
分类号 H01L33/20;H01L33/00;H01L33/42 主分类号 H01L33/20
代理机构 代理人
主权项 1. An LED die comprising: a substrate; a first semiconductor layer, an active layer, a second semiconductor layer and a transparent conductive layer successively stacked on the substrate; and a first electrode and a second electrode respectively formed on the first semiconductor layer and the transparent conductive layer; wherein a plurality of grooves are defined in the first semiconductor layer, and a plurality of hole groups are defined in the second semiconductor layer.
地址 Hsinchu Hsien 303 TW