发明名称 FIN STRUCTURE AND METHOD FOR FORMING THE SAME
摘要 According to an exemplary embodiment, a method of forming a fin structure is provided. The method includes the following operations: etching a first dielectric layer to form at least one recess and a first core portion of a fin core; form an oxide layer as a shallow trench isolation layer in the recess; etching back the oxide layer to expose a portion of the fin core; and forming a fin shell to cover a sidewall of the exposed portion of the fin core.
申请公布号 US2016064493(A1) 申请公布日期 2016.03.03
申请号 US201514937327 申请日期 2015.11.10
申请人 Taiwan Semiconductor Manufacturing Company Limited 发明人 LIN CHUN-HSIUNG;DIAZ CARLOS H.;CHANG HUI-CHENG;JANG SYUN-MING;HUANG MAO-LIN;WANG CHIEN-HSUN
分类号 H01L29/205;H01L29/06;H01L29/78;H01L21/762 主分类号 H01L29/205
代理机构 代理人
主权项 1. A semiconductor device, comprising: a source region; a drain region; a fin structure, comprising: a fin core protruding from a substrate; anda fin shell covering a portion of a sidewall of the fin core; a gate dielectric covering the fin shell; and a gate electrode covering the gate dielectric, wherein the fin structure connects the source region and the drain region, and the fin shell serves as a channel region of the semiconductor device.
地址 Hsinchu TW