发明名称 |
FIN STRUCTURE AND METHOD FOR FORMING THE SAME |
摘要 |
According to an exemplary embodiment, a method of forming a fin structure is provided. The method includes the following operations: etching a first dielectric layer to form at least one recess and a first core portion of a fin core; form an oxide layer as a shallow trench isolation layer in the recess; etching back the oxide layer to expose a portion of the fin core; and forming a fin shell to cover a sidewall of the exposed portion of the fin core. |
申请公布号 |
US2016064493(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201514937327 |
申请日期 |
2015.11.10 |
申请人 |
Taiwan Semiconductor Manufacturing Company Limited |
发明人 |
LIN CHUN-HSIUNG;DIAZ CARLOS H.;CHANG HUI-CHENG;JANG SYUN-MING;HUANG MAO-LIN;WANG CHIEN-HSUN |
分类号 |
H01L29/205;H01L29/06;H01L29/78;H01L21/762 |
主分类号 |
H01L29/205 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device, comprising:
a source region; a drain region; a fin structure, comprising:
a fin core protruding from a substrate; anda fin shell covering a portion of a sidewall of the fin core; a gate dielectric covering the fin shell; and a gate electrode covering the gate dielectric, wherein the fin structure connects the source region and the drain region, and the fin shell serves as a channel region of the semiconductor device. |
地址 |
Hsinchu TW |