VARIOUS STRESS FREE SENSOR PACKAGES USING WAFER LEVEL SUPPORTING DIE AND AIR GAP TECHNIQUE

摘要

Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.

主权项

1. A sensor package comprising:
a supporting die comprising a recess area and a support anchor protruding above the recess area; and a sensor die bonded to the support anchor in a single-sided support cantilever configuration such that a hanging area of the sensor die extends laterally from a contact area of the sensor die directly over the support anchor and an air gap exists between the hanging area of the sensor die and the recess area, and the sensor die comprises a sensor positioned directly above the air gap.