发明名称 |
MEMS DEVICE AND METHOD FOR MANUFACTURING A MEMS DEVICE |
摘要 |
A method for producing a MEMS device comprises forming a semiconductor layer stack, the semiconductor layer stack comprising at least a first monocrystalline semiconductor layer, a second monocrystalline semiconductor layer and a third monocrystalline semiconductor layer, the second monocrystalline semiconductor layer formed between the first and third monocrystalline semiconductor layers. A semiconductor material of the second monocrystalline semiconductor layer is different from semiconductor materials of the first and third monocrystalline semiconductor layers. After forming the semiconductor layer stack, at least a portion of each of the first and third monocrystalline semiconductor layers is concurrently etched. |
申请公布号 |
US2016060105(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201514832001 |
申请日期 |
2015.08.21 |
申请人 |
Infineon Technologies AG |
发明人 |
KOLB Stefan;MEISER Andreas;SCHLOESSER Till;WERNER Wolfgang |
分类号 |
B81C1/00;B81B3/00 |
主分类号 |
B81C1/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for producing a MEMS device comprising:
forming a semiconductor layer stack, the semiconductor layer stack comprising at least a first monocrystalline semiconductor layer, a second monocrystalline semiconductor layer and a third monocrystalline semiconductor layer, the second monocrystalline semiconductor layer formed between the first and third monocrystalline semiconductor layers, wherein a semiconductor material of the second monocrystalline semiconductor layer is different from semiconductor materials of the first and third monocrystalline semiconductor layers; and after forming the semiconductor layer stack, concurrently etching at least a portion of each of the first and third monocrystalline semiconductor layers. |
地址 |
Neubiberg DE |