| 摘要 |
Provided is a cooling system which efficiently cools a plurality of electronic equipment placed at a high density in a small-volume cooling pool while reducing loss of a coolant caused by evaporation. The cooling system 10 is configured to accommodate a plurality of electronic equipment 100 in an open space of a cooling pool 12 in which are provided an entrance 14 and exit 16 for a coolant 13, wherein the plurality of electronic equipment 100 is immersed and directly cooled in the coolant 13 circulating in the open space. The coolant 13 contains a perfluorinated compound as a main ingredient, and has a liquid weight reduction rate of at most 1.5% when 100 hours have passed when 10 ml of the coolant is placed in a 10-ml graduated cylinder (11.5 mm-diameter opening) and allowed to evaporate naturally in a normal environment at a room temperature of 25 °C. Moreover, the coolant 13 can be configured such that the coolant has a vapor pressure of at most 1.0 kPa at a room temperature of 25 °C, and/or a boiling point of at least 150 °C. |
