| 摘要 |
The present invention relates to an impedance bond having improved structure stability and insulation and, more specifically, to an impedance bond having improved structure stability and insulation, in which structures of a bus and a transformer are improved. The impedance bond comprises: an empty accommodating box (B) having a connection slot (NH) formed therein; a neutral bus (11) and trajectory buses (12a, 12b) disposed in the accommodating box (B) and having a connection terminal discharged to the outside of the accommodating box through the connection slot (NH); a pair of supporters (S1, S2) disposed on both surfaces facing each other in the accommodating box (B), and supporting the neutral bus (11) and trajectory buses (12a, 12b); a pair of coils (14a, 14b) disposed between the pair of supporters (S1, S2); a pair of cores (13a, 13b) coupled to the pair of coils; insulation plates (In1, In2, In3) coupled to the connection slot (NH); and a pair of coupling bars (LB) for connecting the supporters (S1, S2). |
