EPOXY RESIN COMPOSITIONS BASED ON BISPHENOL F TYPED EPOXY RESIN FOR HIGH PRESSURE RESIN TRANSFER MOLDING

摘要

Provided is an epoxy resin composition for high pressure-resin transfer molding (HP-RTM) based on a bisphenol F-type epoxy resin comprising a modified epoxy resin; a first bisphenol F-type epoxy resin composition including 80-90 parts by weight of a compound represented by chemical formula 4 for total weight of the first bisphenol F-type epoxy resin composition; a second bisphenol F-type epoxy resin composition distilled to have higher purity than the first bisphenol F-type epoxy resin composition; and a curing agent. Provided in embodiments of the present invention is an epoxy resin composition for HP-RTM having excellent viscosity, gel time and the like.