CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT

摘要

A connection arrangement includes at least one electric and/or electronic component. The at least one electric and/or electronic component has at least one connection face, which is connected in a bonded manner to a join partner by means of a connection layer. The connection layer can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer is arranged adjacent to the connection layer in a bonded manner. The reinforcement layer has a higher modulus of elasticity than the connection layer. A particularly good protective effect is achieved if the reinforcement layer is formed in a frame-like manner by an outer and an inner boundary and, at least with the outer boundary thereof, encloses the connection face of the at least one electric and/or electronic component.

主权项

1. A connection arrangement (100, 200, 300, 400) of at least one electric and/or electronic component (10), wherein the at least one electric and/or electronic component (10) has a connection face (11), which is connected in a bonded manner to the join partner (40) by a connection layer (20), wherein
a reinforcement layer (30′) is arranged adjacent to the connection layer (20), said reinforcement layer (30′) having a higher modulus of elasticity than the connection layer (20), wherein the reinforcement layer (30′) is formed in a frame-like manner by an outer boundary and an inner boundary (36, 35) and, at least with the outer boundary (36) thereof, encloses the connection face (11) of the at least one electric and/or electronic component (10), and wherein the reinforcement layer (30′) comprises at least one intermetallic phase.