SEMICONDUCTOR DEVICE

摘要

This invention provides a semiconductor device with improved reliability. A pad includes a slit portion formed so as to pass through the pad, and also includes a bonding portion positioned inside the slit portion in plan view, and an edge portion positioned outside the slit portion in plan view. In plan view, a via encloses the slit portion and is in contact with the bonding portion of the pad and the edge portion of the pad.

主权项

1. A semiconductor device comprising:
a semiconductor substrate; a wiring that is formed above the semiconductor substrate; a first via that is formed over the wiring and electrically coupled to the wiring; a pad that is formed over the first via and electrically coupled to the first via; a surface protective film that covers the pad; and an opening that is formed in the surface protective film and exposes a part of a surface of the pad, wherein the pad includes: a slit portion that passes through the pad; a bonding portion that is positioned inside the slit portion in plan view; and an edge portion that is positioned outside the slit portion in plan view, and wherein, in plan view, the first via encloses the slit portion and is in contact with the bonding portion of the pad and the edge portion of the pad.