Word Line Hook Up with Protected Air Gap

摘要

A method of forming a semiconductor device includes forming a plurality of word lines separated by air gaps with contact pad structures connected to the word lines, and forming a dummy structure directly opposite an air gap between neighboring word lines. Subsequently, the contact pad structures are cut into individual contact pads by a contact pad cut that intersects the dummy structure.

主权项

1. A semiconductor device comprising:
a plurality of word lines separated by air gaps; a plurality of contact pads, an individual contact pad connected to an individual word line; a contact pad cut that extends between neighboring contact pads, the contact pad cut separating the neighboring contact pads; and a dummy structure that is intersected by the contact pad cut, the dummy structure located directly opposite an air gap between neighboring word lines.