SEMICONDUCTOR DEVICE

摘要

The purpose of this invention is to obtain a semiconductor device having a highly reliable join part. The semiconductor device pertaining to the invention is provided with an insulating substrate (1) on which an electroconductive pattern (4b) is formed, and a semiconductor element and an electrode terminal (6) joined to the electroconductive pattern (4b). The electrode terminal (6) and the electroconductive pattern (4b) are ultrasonically joined at a joining surface (7). The ultrasonic joining is performed at a plurality of sites.