| 摘要 |
The purpose of the present invention is to provide a semiconductor device that can maintain insulation resistance between two circuits that require insulation while also allowing for a device to be made compact. On the surface of a compact power module (4A), a lower arm control substrate (2A), an insulator (3), and an upper arm control substrate (1A) are disposed in layers in that order. An upper arm principal region (10) and a lower arm principal region (20) are disposed so as to overlap with the insulator (3) in plan view and the majority of the upper arm principal region (10) and the lower arm principal region (20) overlap in plan view. The upper arm control substrate (1A) and an upper arm control substrate (1B) are substrates with identical structures, and the lower arm control substrate (2A) has a positional relationship with the upper arm control substrate (1A) such that the upper arm control substrate (1A) has been rotated 180° in the horizontal plane. |
