| 摘要 |
A module assembly (10) for a transmission control module (50) and a transmission control module (50) are proposed. The module assembly (10) has a substrate plate (12) with an electronic circuit (14) which is arranged on a mounting side (13) of the substrate plate (12) and has at least one unhoused semiconductor component (16) which is in contact with exposed bonding wires. The module assembly (10) is defined, in particular, by the fact that it also has a contact frame (18) which runs around the electronic circuit (14) on the mounting side (13) of the substrate plate (12) in an annular fashion, and in that the electronic circuit (14) is completely cast with a protective material (20), in particular for protecting the bonding wires of the semiconductor component (16). As result, costly transportation packaging for the module assembly (10), for example for transportation into an assembly works of the transmission control module (50) can be advantageously dispensed with. |
