| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device which can be mounted with high positional accuracy with respect to a surface direction of a mounting substrate when mounted to the mounting substrate by automatic soldering and which has high radiation performance to heat generation of a semiconductor light emitting element when light is emitted.SOLUTION: A semiconductor light emitting device comprises a pair of lead frames 30, 31 where one lead frame 30 has a symmetrical shape across the other lead frame 31 and which are arranged in parallel with each other on the same plane. One end side of the pair of lead frames 30, 31 is embedded in a resin compact having a concavity where a semiconductor light emitting element 7 is mounted on one of exposed parts exposed on a bottom face of the concavity. The other end side of the pair of lead frames 30, 31 has bent extension parts 30c, 31c which extend from the resin compact in a direction opposite to a light emission direction of the semiconductor light emitting element 7 and each of both bent extension parts 30c of the one lead frame 30 has a notch 30f which extends in a width direction from one end in the width direction.SELECTED DRAWING: Figure 6 |
